| 초록 |
Ceria(CeO2) is mainly used as abrasives of slurry in CMP(Chemical Mechanical Polishing / Planarization) process. Particularly, it is widely used for STI (Shallow Trench Isolation) CMP due to its chemical tooth mechanism, which stems from property of both Ce3+ and Ce4+ resulting in a higher removal rate rather than silica (SiO2) or alumina (Al2O3) in the CMP process. However, ceria has fluorite molecular structure, which is an extremely angular shape causing defects on the wafer during CMP process. In order to reduce the defects, many studies are being actively carried out to change the morphology of the ceria to spherical shape. In this study, we introduce the synthesis of ceria particles with the perfect sphere shape. The ceria spheres are successfully synthesized via a hydrothermal method by employing cerium nitrate(Ⅲ) and polyvinylpyrrolidone(PVP). The size of as-synthesized CeO2 particles is about 1μm under the condition of 180°C and 8hours and has the perfect sphere shape. |
