| 초록 |
Microelectromechanical system (MEMS) is an assembly of sensors, actuators, and mechanical elements on a silicon wafer substrate, and has received a lot of attention from researchers. However, most MEMS device failures usually occur when components come into contact with one another, thus representing a critical limitation in the lifespan of MEMS devices due to tribological issues. Adhesion, friction, and wear have been recognized as major concerns in the performance and reliability of MEMS devices, and hence, surface modification and/or coatings have been widely developed to reduce tribological issues. Briefly, our approach is based on the use of the chemical ligand, 3-mercaptopropyltrimethoxylsilane (3-MPTMS), which serves to enhance chemical interaction between Au NPs and the silicon surface. Here we explore as to how the various deposition conditions such as the concentration of Au NPs and 3-MPTMS, and deposition time allow us to create controllable, well-ordered Au NPs on substrate. In addition, the change in chemical structure of Au NPs through the application of 3-MPTMS was analyzed by scanning electron microscopy/energy dispersive X-ray spectroscopy (SEM/EDS). |
