| 초록 |
In this work, the thermal stabilities, electrical properties, and fracture behaviors of hollow glass microspheres filled diglycidyl ether of bisphenol A (DGEBA) composites were investigated using thermogravimetric analysis (TGA), dielectric spectromete, and a universal testing machine (UTM). Diaminodiphenol methane (DDM) was used as curing agent and the weight contents of filler range varied from 0 to 2 wt%. As a result, the hollow glass microspheres filled composites showed lower coefficient of thermal expansion and dielectric constant than those of neat epoxy resins. And, the glass transition temperature and mechanical interfacial properties of the composites studied were significantly higher than those of neat epoxy resins. This was due to the introduction of hollow glass microspheres into the epoxy resins, resulting in improving the interfacial interaction between the filler and the epoxy matrix in the composites. |
