| 학회 | 한국공업화학회 |
| 학술대회 | 2016년 가을 (10/26 ~ 10/28, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 | 20권 2호 |
| 발표분야 | 정밀화학_포스터 |
| 제목 | Study of ethylene glycol based levelers which have different functional group for Cu electrodeposition in microvias |
| 초록 | Cu electrodeposition has been used for making the electrical circuits for various electronic devices like microvia in printed circuit board (PCB), damascene features, and Through Silicon Via (TSV). Organic additives play an important role for defect-free filling and above all additives, levelers enable to obtain perfect gap-filling of Cu by electrodeposition in case of relatively large size like microvia in PCB and TSV for 3-dimensional packaging. In this study, we have synthesized various ethylene glycol based levelers by changing alkly chain and the functional groups. The electrochemical properties were analyzed by Linear Sweep Voltammetry (LSV) and filling results of the synthesized levelers on microvia are reported. Finally, we suggested that the quaternary ammonium group and the ethylene oxy functional groups were crucial for the improved filling performance. |
| 저자 | 오정환, 서영란, 이명현, 이병일, 김재정, 김영규 |
| 소속 | 서울대 |
| 키워드 | levelers; Cu electrodeposition; microvia |
