화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2017년 봄 (04/05 ~ 04/07, 대전컨벤션센터)
권호 42권 1호
발표분야 고분자구조 및 물성
제목 Kinetic Analysis on Epoxy Molding Compound with Latent Catalysts
초록 Epoxy molding compound (EMC) has been widely used as packing materials for semiconductor to prevent inner circuits from electrical failure. Kinetic studies on molding process have been conducted to improve the reliability of EMC. We performed kinetic analysis of EMC at molding condition by differential scanning calorimetry (DSC) using a dynamic measurement with various latent catalysts. To analysis the results from DSC, model free kinetic (MFK) method and model fitting method was also applied to estimate the cure reaction.
저자 이다은, 김현우, 공병선, 최형욱
소속 KCC중앙(연)
키워드 Epoxy Molding Compound; Latent Catalysts; Kinetics
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