| 학회 |
한국공업화학회 |
| 학술대회 |
2015년 가을 (11/04 ~ 11/06, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 |
19권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Modification of the IT Epoxy Adhesive for Low-Temperature Curing Property by Sol-Gel Method. |
| 초록 |
Light emitting diodes (LEDs) have increasingly been studied for application in the fields of displays and lighting to fabricate environmentally friendly illumination devices with low energy consumption. The LED adhesive is essential to stick the light diffusion lens on the substrate for smooth and bright light of the LED. The LED lens adhesive shows different characteristics with general epoxy adhesives such as low-temperature and fast curing. However, it is generally imported from aboard and used. Therefore, a new material which developed by domestic technology is requied. In this study, We synthesized Oligosiloxane resins with the higher degree of condensation indicated low shrinkage and effective curing behavior via non-hydrolytic sol-gel method. It was introduced as a hardner of epoxy adhesive to improve the low-temperature curing property and Pot-life. The curing property was analyzed by Differential Scanning Calorimetry (DSC). |
| 저자 |
이상국1, 이태규2, 송호준1, 강주희1, 권세진1, 나영재1
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| 소속 |
1한국생산기술(연), 2연세대 |
| 키워드 |
IT Epoxy adhesive; LED; Curing characteristic
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| E-Mail |
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