| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO)) |
| 권호 |
23권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
A Novel Diamine Curing Agent with Mesogen Side Group as for Improved Thermally Conductive Composites |
| 초록 |
Recently developments in thermal dissipation have heightened the need for advanced polymeric thermal conductive composite with inexpensive, easy handling, prominent workability and outstanding mechanical properties. A major problem with polymers in thermal dissipation is a low thermal conductivity in the range of 0.10-0.25 W m-1K-1. In this work, we report a novel technique to improve the thermal conductivities of boron nitride(BN)-incorporated epoxy resin composites for superior insulating thermally conductive composites. We successfully synthesized a novel kind of curing agent, diamine with mesogen side group via esterification reaction. We prepared four kinds of mixtures by adding each hydroxyl h-BN fabricated via a facile hot-press process. We investigate the thermal properties of new diamine as curing agent for improved thermally conductive composites. |
| 저자 |
강주희, 박성원, 임종태, 석웅철, 권세진, 송호준, 이상국
|
| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy resin; Boron nitride; Thermal conductivity
|
| E-Mail |
|
