| 학회 | 한국재료학회 |
| 학술대회 | 2017년 봄 (05/17 ~ 05/19, 목포 현대호텔) |
| 권호 | 23권 1호 |
| 발표분야 | A. 전자/반도체 재료 분과 |
| 제목 | Investigation of Particle Contamination and Removal Mechanism with Corrosion Inhibitors for Cu CMP Application |
| 초록 | Due to the introduction of chemical mechanical planarization (CMP) process to semiconductor industry, copper has been widely used as an interconnect material instead of aluminum, because copper has better electrical properties than aluminum such as low resistivity and high electro-migration resistivity. However, copper CMP process leads to various defects, for example, slurry particle, organic residue, scratch and corrosion. Mainly copper surfaces can become contaminated by slurry particles and organic residues during CMP. Silica particles are widely used as abrasives, while benzotriazole (BTA) is widely used as corrosion inhibitor in copper CMP slurries. These materials contaminate the copper surface during CMP and need to be removed at post-Cu CMP cleaning process. It is very important to understand the mechanism of the particles contamination with corrosion inhibitors. In this study, therefore, particle removal efficiency was analyzed on copper surfaces contaminated by various slurries. To investigate the effect of corrosion inhibitor on particle contamination and removal, particles and corrosion inhibitors were contaminated on copper surfaces by CMP process using various slurries, (1) only abrasives, (2) abrasives + BTA, and (3) abrasives + M-BTA. Contaminated copper surfaces were cleaned by TMAH based cleaning solution. Particle removal was calculated by observing and counting particles on copper surface before and after cleaning process using FE-SEM and image processing software. BTA was characterized using contact angle measurements and electrochemical impedance spectroscopy (EIS) techniques with electrical equivalent circuit modeling. The corrosion protection ability of the cleaning solutions was quantified by potentiodynamic polarization studies. |
| 저자 | Hae-Jung Pyun1, Byoung-Jun Cho1, Jin-Yong Kim1, Jin-Goo Park2 |
| 소속 | 1Department of Bionanotechnology, 2Department of Materials Science and Chemical Engineering and Department of Bionanotechnology |
| 키워드 | <P>post-Cu CMP; particle removal efficiency; BTA; MBTA; electrochemical impedance spectroscopy</P> |
