| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.476 |
| 발표분야 | 고분자 합성 |
| 제목 | Synthesis and characterization of poly(urethane-imide)s with low residual stress for electronic materials applications |
| 초록 | Poly(urethane-imide)s were prepared by reaction between crosslinkable endgroup containing soluble polyimide (PI) by chemical imidization and various polyurethane(PU) endcapped with hydroxyl ethyl acrylate(HEA). Poly(amic acid) was prepared from 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and oxydianiline (ODA) and then end-capped with maleic anhydride (MA). The PU prepolymers were prepared by the reaction of different diols(polycaprolactone diol, Polytetramethylene ether glycol and Poly(hexamethylene carbonate) diol) and different diisocyanates(tolylene 2,4-diisocyanate, isophorone diisocyanate and 1,6-hexamethylene diisocyanate) and endcapped with hydroxyl ethyl acrylate. The effect of PU content and a various chemical structure of PU on the residual stress behavior, dielectric constant, thermal property and morphology was studied. The poly(urethane-imide)s were characterized by FT-IR, TGA, Thin film Stress Analyzer (TFSA), XRD and prism coupler. Low residual stress and slope in cooling curve were achieved by higher PU content and .by introduction of polycaprolactone diol and isophorone diisocyanate. Dielectric constant was decreased when the content of PU was increased and when poly(hexamethylene carbonate) diol and hexamethylene diisocyanate were used for PU prepolymer. Compared to typical polyurethane , these polymers exhibited better thermal stabilities due to the presence of the imide groups. Acknowledgement This work was supported by The Consortium Project of Joint of Industry, Education, Research of Small and Medium Business Administration. |
| 저자 | 박미희, 장원봉, 조태수, 양승진, 설용건, 한학수 |
| 소속 | 연세대 |
| 키워드 | polyimide; polyurethane; residual stress behavior; dielectric constant; thermal property; crosslinking reaction |
