| 초록 |
Soft Lithography is the attractive patterning method because it is a chip, fast, easy process. In some of these method, heating to high temperature is needed. Thermal expansion of soft mold is occurred in that methods but it was just a problem until now. It is not be highlighted as application. But in this study, we found that the strain gradient from the thermal expansion makes interesting patterns. We use the PDMS mold that have various shapes, and various polymer thin film. PEO, PCL, PMMA, PS are employed for this study. Also we can observed patterns that have not 'residual layer'. Most soft lithography methods have the residual layer problem. AFM, SEM, In-situ optical microscopy were employed for characterize the patternes. |
