| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 봄 (05/02 ~ 05/04, 대구 엑스코(EXCO)) |
| 권호 |
22권 1호 |
| 발표분야 |
콜로이드계면화학_포스터 |
| 제목 |
A study on superior adhesive strength between glass fiber and Ni-plating layer by thermal method |
| 초록 |
In this work, the electroless plating method was ap-plied to deposit a layer of Ni–P metal on the surface of glass fibers. Then, effects of post heat-treatment on interfacial bonding be-tween glass fibers and the plating layer were investigated. The structure of nickel after heat treatment, XPS binding energy and inter-facial strength were measured. The objective is to develop a conductive glass fiber that has great interfacial bonding properties and could be used as a functional filler in composite materials for electronics. |
| 저자 |
한웅1, 정용식2, 김병주3
|
| 소속 |
1한국탄소융합기술원 / 전북대, 2전북대, 3한국탄소융합기술원 |
| 키워드 |
nickel plating; glass fiber; adhesive strength; post-heat treatment
|
| E-Mail |
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