| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 가을 (10/09 ~ 10/10, 일산킨텍스) |
| 권호 |
33권 2호 |
| 발표분야 |
고분자 구조 및 물성 |
| 제목 |
Adhesion Properties of Metallic Plasma Deposited on Polyimide Films by Ion Beam Treatment |
| 초록 |
In order to interconnect device elements or layers on the flexible substrate, the width and conductivity of metallization lines are very important for minimizing the size of flexible electronic devices. Especially, the utilization of an ion beam irradiation is a potential technique to achieve a good adhesion. In this study, the effect of N+ ion implantation on the adhesion strength of a metal/polyimide film as a function of the ion fluence was investigated. A Cu thin film on a polyimide substrate was prepared by an evaporation of Cu metal. The adhesion properties of the Cu thin film were evaluated by means of scratch test. The surface properties of the ion implanted polyimide were investigated by means of a scanning probe microscope, contact angle and X-ray photoelectron spectroscopy. |
| 저자 |
신진욱1, 전준표1, 김현빈1, 서동권2, 김은정2, 강필현1
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| 소속 |
1한국원자력(연), 2충남대 |
| 키워드 |
Ion implantation; Polymer film; Scratch test; Adhesion
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| E-Mail |
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