| 학회 |
한국고분자학회 |
| 학술대회 |
2022년 봄 (04/06 ~ 04/08, 대전컨벤션센터) |
| 권호 |
47권 1호 |
| 발표분야 |
고분자구조 및 물성 |
| 제목 |
Dual-cure adhesive with enhanced thermal resistance: Preparation of epoxy terminated polybutadiene |
| 초록 |
We modified hydroxyl terminated polybutadiene (HTPB) to epoxidize its hydroxyl group at the ends. We applied the epoxidized (ETPB) to a thiol/acrylate adhesive system to investigate dual-cure characteristics. We suggested a synthetic mechanism for the ETPB and also photo/ thermal dual-cure mechanism. We confirmed the structure of the ETPB using fourier transform infrared and nuclear magnetic resonance spectroscopy. Furthermore, we evaluated thermal properties via thermogravimetric analysis and differential scanning calorimeter. We measured lap-shear strength according to molar ratio of ETPB and thiol/acrylate using a universal testing machine. We evaluated storage stability of dure-cure adhesives according to the stabilizer content and gel fraction. |
| 저자 |
김해찬1, 김은지1, 권용록1, 김정수1, 김종호2, 김동현1
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| 소속 |
1한국생산기술(연), 2한양대 |
| 키워드 |
Dual-cure; Adhesive; Thermal resistance; Lap-shear strength; Storage stability.
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| E-Mail |
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