| 초록 |
In the recent decades, nanocomposites containing conductive fillers dispersed in polymer matrix have been widely applied in micro-electronic packaging as alternative materials due to the electrical conductivity, low processing temperature and flexible and simple processing. Silver is considered an attractive filler for various polymers because of its high thermal conductivity and electrical conductivity. In this study, electrical and thermal properties of nanocomposite filled with silver nanoparticles(SNP) and uniform distribution of silver flakes(SNF) were in-situ synthesized by thermal decomposition of imidazole-silver complex (IA) during the epoxy curing process. This study presents a simple and novel approach to prepare highly conductive epoxy-based composites composed of micron-sized SNF, SNP and additional SNPs by in-situ process. Furthermore, the electrical and thermal properties of nanocomposite filled with various ratios of SNP and SNF was confirm. |
