| 초록 |
Many industries are focused on the development of the inkjet printing technology. Among conventional metallic inks, silver ink is a typical metallic ink having high conductivity and thermal stability. However, there is a limitation to use it in the fabrication due to its high material cost. Copper is considered as a substitute material for replacing silver, but copper ink has an oxidation issue under atmospheric conditions. Copper complexes and copper nano particles were used in the synthesis to prevent its oxidation. The synthesized nano particles were thermally treated in the range of 300~700℃. The prepared copper ink was printed on the silicon substrate and the printed film was then characterized. Resistivity of the printed electrode was calculated from the cross-sectional area measured by a profilometer and resistance was measured by a digital multimeter. Surface morphology of the prepared electrode was also analyzed using scanning electron microscope(SEM). |
