| 초록 |
For realizing high I/O density, it is necessary to develop a fine pitch soldering.At soldering, it is important to uniform a solder volume and to fill up solder on the PCB. If solder bump is omitted, it is problem to connect PCB with device. For improving solder bumping, it has several methods. One is which it develops the material.And the other is which it optimizes a process. We try to coat metal mask by polymer for improving a filling of the solder. Metal mask is treated to hydrophobic materials after dipping acid solvent or base solvent. |
