화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2022년 봄 (04/06 ~ 04/08, 대전컨벤션센터)
권호 47권 1호
발표분야 고분자구조 및 물성
제목 A study on the synthesis of silsesquioxane oligomers capable of odor control and the thermal properties of epoxy molds using the same.
초록 The one-component epoxy adhesive undergoes a crosslinking reaction through heating to cause curing, and usually requires a temperature of 120 °C or higher. Thus, the general adhesive curing conditions may damage the temperature-sensitive electronics. Most of the mercaptan curing agents having -SH functional groups are used in liquid form, and in general, the curing reaction between epoxy and mercaptan is faster at low temperature than the reaction between epoxy and amine, so it is expected to show fast curing properties at low temperature. However, hardening agents containing thiol groups had problems in application due to the unique odor of sulfur. Therefore, in this study, a curing agent containing a thiol group was prepared using the one-pot method. The odor level of the thiol curing agent was analyzed by introducing the air sensory dilution method. In addition, the thermal properties of the epoxy-based mold including the hardener having a -SH functional group were analyzed.
저자 김영훈, 김영랑, 박성만, 장기철, 백정주, 신교직, 최경호
소속 한국생산기술(연)
키워드 Mercaptan; Epoxy; Thermal curing
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