| 초록 |
ALD (atomic layer deposition) is one of the most advanced thin film coating or deposition technique in the current vacuum science or electronic device fabrication processes. Recently, the matured ALD technique begins to look for new applications with its strong advantages such as the superior step coverage (conformality) on complicated 3D structures and extremely-precise film thickness controllability. One of the prospective application of ALD technique is the electrical/chemical passivation of solarcell devices, of which fabrication process and physics are familiar with those of semiconductor devices. Another important application of ALD technique could be the design of core-shell structured nano-particles for multifunctional applications. A specially designed ALD reactor enables the successful fabrication of core-shell structured nanoparticles irrespective of the chemical reaction conditions (pH, temperature etc). For example, Al2O3/TiO2, TiO2/ZnO, Al2O3/Li(NMC)O2, etc., are found to exhibit unique properties as a cosmetic material, photocatalyst, battery electrode material. Furthermore, controlled deposition is a unique feature of ALD which enables flexibility in optimizing the properties of the material under study with minimal effort. A brief introduction to the principle of the ALD process for particle coating technology will be discussed with a few experimental results. |
