| 초록 |
Acrylic pressure-sensitive adhesives (PSAs) have many applications in industry. As the Si-wafers become thinner, the acrylic PSAs need to show proper adhesion on the silica thin wafer without causing any damage. Easy and clean debonding is needed in transporting process to protect the Si-wafers. In this work, the acrylic copolymers were synthesized by solution polymerization of 2-ethylhexyl acrylate, ethyl acrylate, and acrylic acid with AIBN as an initiator. The azodicarboxamide(AC) was used as foaming agent. The adhesion performance of AC/PSA was investigated using probe tack, peel strength, and cohesive test. The debonding property of PSA was improved by forming the expanded PSA foam structures with AC upon heat-treatment. |
