| 초록 |
For inkjet-printed metal interconnects for various applications, it is important to optimize the electrical performance, i.e. electrical resistivity, of the interconnects. In this talk, the relationship between the electrical resistivity of inkjet-printed Ag interconnects and the process conditions, e.g. annealing temperature, ambient and time, etc. will be discussed in terms of their microstructure characteristics. The isothermal annealing results show that the change in the electrical resistivity measured ex situ is dominated by the kinetics of change in microstructure. Available models for prediction of electrical resistivity based on microstructural features such as grain size, porosity or vacancy will be reviewed and accounted for. |
