초록 |
Two-dimensional (2D) materials have been considered as potential building blocks for use in fundamental elements of electronic, optoelectronics, and energy storage, because of their diverse and remarkable properties. However, such fundamental approaches cannot directly be applied practically because of issues such as precise alignment/positioning and large-quantity material production. I will demonstrate wafer-scale vdW heterostructures by exploiting the lateral and vertical assembly of solution-processed 2D vdW materials. The high exfoliation yield of the molecular intercalation-assisted approach enables the production of micron-sized nanosheets in large quantities and its lateral assembly in a wafer-scale via vdW interactions. Subsequently, the laterally assembled vdW thin-films were vertically assembled to demonstrate various electronic device applications, such as transistors and photodetectors. Furthermore, multi-dimensional vdW heterostructures were demonstrated by integrating one-dimensional carbon nanotubes as a p-type semiconductor to fabricate p–n diodes and complementary logic gates. Lastly, electronic devices were fabricated via inkjet printing as a lithography-free manner based on the stable nanomaterial dispersions. |