| 초록 |
In this study, a novel diglycidylether of bisphenol A-silicon (DGEBA-Si) epoxy resin was synthesized. And, the cure behavior, glass transition temperature (Tg ), and thermal stability of the DGEBA-Si/DDM system were characterized by using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and thermogravimetric analysis (TGA). For the mechanical properties of the casting specimens, the critical stress intensity factor (KIC) and flexural strength were measured. As a result, Tg of the DGEBA-Si/DDM system was lower than that of the commercial DGEBA/DDM system. Whereas, the DGEBA-Si/DDM system showed higher mechanical interfacial properties than those of the DGEBA/DDM system. This was attributed to the introduction of silicon units into the main chain of the epoxy resin, resulting in improving the flexibility in the DGEBA-Si/DDM system. |
