| 초록 |
Surface wrinkling can be occurred when compressive stress in the film exceeds the critical stress, and there have been a number of researches on instability of wrinkling. Since most of electronic devices in nano-scale possess sequentially stacked layer structure, instability of surface wrinkling on multilayer can be significant tool for fabrication of electronic device. However, most of researches focus on wrinkling on bilayer, not for the wrinkling on multilayer. Therefore, instability of wrinkling on multilayer has been less investigated. In this research, we designed models for free energy analysis that can analyze multilayer wrinkling, and derived relationship between measurable parameter such as wavelength of wrinkled surface, elastic modulus, poisson’s ratio and thickness. In addition we introduced metrology that can overcome the limitation of conventional metrology based on bilayer wrinkling s application of this instability of multilayer wrinkling. |
