| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 가을 (10/30 ~ 11/01, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 |
23권 2호 |
| 발표분야 |
포스터_화학공정 |
| 제목 |
Thermal conductivity epoxy resin composites filled with boron nitride nanoplatelets |
| 초록 |
Hexagonal boron nitride (h-BN) has outstanding in-plane thermal conductivity. However, when employed as a thermally conductive filler for polymer composites, it is hard to construct heat-transferring thermal linkage in the matrix with low filler content due to its stacked two-dimensional form. Bulk BNs need to be exfoliated into thinner layers to connect themselves. In this study, liquid phase exfoliation method was applied to fabricate BN nanoplatelets (BNNPs) assisted by additional shear force from Fe3O4 nanoparticles. The resultant BNNP was incorporated in epoxy matrix to fabricate thermally conductive composite. After the exfoliation, BN showed better dispersion in polymer composite compared to bulk BN due to reduced mean inter-particle distances. Thus, the introduction of BNNP enables the decrease in the thermal percolation threshold via the formation of heat flow paths and enhancement of the thermal conductivity by 480% with the additrion of a filler content of 30 wt%. |
| 저자 |
김유진, Eyob Wondu, Zelalem Lule, 김주헌
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| 소속 |
중앙대 |
| 키워드 |
epoxy composites; exfoliation; boron nitirdie
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| E-Mail |
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