| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 가을 (10/07 ~ 10/08, 대구 EXCO) |
| 권호 |
35권 2호 |
| 발표분야 |
고분자 구조 및 물성 |
| 제목 |
The effect of additives and curing condition on polycrystalline structure in biphenyl type |
| 초록 |
The changing of the free volume in biphenyl type epoxy with surfactant and pre-curing temperatures was studied. Free volume was calculated with coefficient of thermal expansion (CTE) measured by thermo-mechanical analysis (TMA). Curing schedules are determined by differential scanning calorimeter(DSC). Polycrystalline structure of epoxy is characterized by transmission electron microscopy (TEM) and electron diffraction. Free volume of epoxy is discussed in terms of the precuring temperature applied to the epoxy systems, their characteristic glass transition temperatures and their crosslink density. The packing of the molecular chains of the epoxy network is governed by precuring temperature and surfactant. |
| 저자 |
김윤성1, 이규원2, 윤호규1
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| 소속 |
1고려대, 2하이닉스 반도체 |
| 키워드 |
epoxy resin; thermo-mechanical analysis; free volume
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| E-Mail |
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