| 학회 | 한국재료학회 |
| 학술대회 | 2021년 봄 (05/12 ~ 05/14, 광주 김대중컨벤션센터) |
| 권호 | 27권 1호 |
| 발표분야 | A. 전자/반도체 재료 분과 |
| 제목 | 2D Single-Crystalline Metallic Nanosheets: Synthesis, Dimension control and Applications |
| 초록 | Among the various metallic materials, copper is promising because it is inexpensive, abundant, and highly conductive. Synthetic methods and growth mechanisms to form various morphologies of Cu nanostructures and their use in various engineering applications have been intensively studied. The growth of anisotropic metallic nanocrystals is possible through a slow reduction process, which provides a better chance to overcome the thermodynamically favored reaction toward the formation of truncated nanocubes or multiple twinned particles due to their intrinsically higher energy compared with other isotropic shapes. The sophisticated controls on kinetics of nucleation and growth is required. In this reason, there have been few reports on growth of Cu nanosheets and their practical applications, compare to Cu nanowires. In this study, we synthesize copper nanowires (Cu NWs) and copper nanosheets (Cu NSs) using a hydrothermal process. The combination of a mild reductant, stabilizer, and shape modifier allow the dimensional control of the Cu nanocrystals from one-dimensional (1D) nanowires to two-dimensional (2D) nanoplates. HR-TEM reveals that the prepared Cu NSs had a single-crystalline structure. From the XPS analysis, we found that iodine plays an important role in the modification of the copper nanocrystals through the formation of an adlayer on the basal plane of the nanoplates. We successfully synthesized Cu NSs with an average edge length of 10 μm, and these Cu NSs are the largest copper 2D crystals synthesized by a solution-based process so far. The application of the metallic 2D crystals as a semi-transparent electrode prove their feasibility as a conductive filler, exhibiting very low sheet resistance (0.4 Ω/□) compared to Cu NWs and a transmittance near 75%. The efficient charge transport is due to the increased contact area between each Cu NS, i.e., so-called plane contact (2D electrical contact). And also, we observed outstanding electromagnetic interference shielding(EMI SE) efficiency from the hierarchical porous film with layer-by-layer assembly of 2D Cu NSs. |
| 저자 | Ho Kwang Choi1, Sukang Bae2, Sang Hyun Lee3, Seoung-Ki Lee4, Tae-Wook Kim5 |
| 소속 | 1Department of Flexible and Printable Electronics, 2Jeonbuk National Univ., 3567 Beakje-daero, 4Deokjin-gu, 5Jeonju |
| 키워드 | <EM>Copper nanoplates; Dimension control; Conductive fillers; Electronic ink; EMI SE</EM> |
