| 초록 |
As electronic devices towards light weight, miniaturization and high-degree integration, efficient heat management is critical factor for lifetime and performance of the devices. In the field of electronic packaging and energy generation/storage, thermally conductive polymeric composites have been considered essential materials for efficient heat dissipation. In this study, the two-dimensional transition metal compound material (2DM) was used as an additive to improve the thermal conductivity of epoxy composites with boron nitride (BN) fillers. Despite the small addition of less than 1 wt%, the 2DMs can improve thermal conductivity of composites by helping to form heat transfer paths. The optimized composite exhibited enhanced thermal conductivity in both in-plane and through-plane directions. |
