| 초록 |
Recently, as the digital mobile devices become slimmer and multi-functional, heat dissipation and EMI (Electro-Magnetic Interference) related problems became more serious issues for electronic circuit designers. So requests for higher performance materials to solve the thermal and EMI related problems are increasing so much. These thermal and EMI related problems have been solved by separate solutions, individually up to now. However, as the digital mobile devices, such as smartphone or tablet PC, become slimmer, there is no more space room for these functional materials. So recently, many engineers are trying to solve these two problems with one solution. In this study, we suggest a good solution for this problem with dual functional sheet made of core-shell structured filler and polymer. |
