학회 | 한국고분자학회 |
학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
권호 | 28권 1호, p.133 |
발표분야 | 고분자 가공/블렌드 |
제목 | Study of the Polymer Deformation in Hot Embossing Process : The effect of Melt Flow Rate on Polymer Deformation |
초록 | Hot embossing process also known as nanoimprinting process has gain broad interest, in particular as low cost method to define nanometer scale patterns and geometries as small as 6 ㎚ have been demonstrated. With a single master, identical structures can be produced as required over large surface. This technique is well established for microstructure and nanostructure fabrication, for example in compact disc molding, in the manufacture of optical devices and quantum structure such as quantum well and dot. Cross-sectional profiles of deformed thermoplastics in hot embossing process were studied and were compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than 60℃ above Tg. When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete penetration of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer. We believe these results can be very useful for optimizing nanoembossing process conditions |
저자 | 윤근병;정명영 |
소속 | 한국전자통신(연) |
키워드 | Hot embossing; micro and nanostructure |