| 초록 |
Influence of Imidazole Curing Agent on Mechanical Properties of Epoxy Based Resin for Hot Melt Adhesives Seungju Noh, Taeyi Choi, Jangsoon Kim FDA PJT, R&D Center, LG Hausys Hot melt adhesive film were made by blending the various type of epoxy resin with imidazole curing agent. Mechanical properties of epoxy resin blends in the presence of imidazole up to 10 phr were investigated. As increasing the amount of imidazole, the values of storage modulus, loss modulus and tanδ were increased. The reason is that the increase in imidazole contents makes higher gel contents of cured film. It was also observed that initial adhesive strength decreases along with the increase in contents of curing agent. |
