| 학회 |
한국공업화학회 |
| 학술대회 |
2010년 봄 (05/13 ~ 05/14, BEXCO(부산)) |
| 권호 |
14권 1호 |
| 발표분야 |
고분자 |
| 제목 |
Thermal Analysis of epoxy resin systems cured by E-beam irradiation |
| 초록 |
In this study, we systematically investigate the effects of E-beam irradiation dosage on a degree of cure in epoxy resin systems composed of Bisphenol A type epoxy resin blended with epoxy diacrylates, inorganic fillers, and/or photoinitiator/curing agents and so on. The blends are irradiated in the form of ~50um thick film on the glass substrate. Thermal properties such as glass transition temperature of the cured resins are analyzed in terms of a degree of cure. Chemical analysis by FTIR will also be presented. Blend compositions are determined on the basis of having appropriated tack for easier handling at room temperature and extension of shelf life at an elevated temperature and low shrinkage ratio upon curing. The blend systems will be applied to development of adhesives for anisotropic conductive film (ACF) and flexible copper clad laminate (FCCL) etc. |
| 저자 |
김은진1, 이정민2, 김재용2, 최재학3, 서영수1
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| 소속 |
1세종대, 2한양대, 3한국방사선(연) |
| 키워드 |
epoxy; E-beam; E-beam curing; ACF; FCCL
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| E-Mail |
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