| 초록 |
In this study, 4, 4′-tetraglycidyl diaminodiphenyl methane (TGDDM)/polyamideimide (PAI) blends were cured using diaminodiphenyl sulfone (DDS), and the effect of PAI content to neat TGDDM on the thermal, mechanical, and morphological properties was investigated. The cure behavior and thermal stability of the cured specimens were monitored by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. Also, the critical stress intensity factor (KIC) was measured in UTM, and the phase separation behavior and morphology of TGDDM/PAI blends were examined in scanning electron microscopy (SEM). With increasing the PAI content, the cure rate and KIC value were increased. But, the KIC value were decreased above 10 phr PAI content. The increasing of cure rate was probably due to the presence of amine group of PAI backbone used as co-initiator. And decreasing of KIC value was explained on the basis of phase separation. Morphology observed from SEM was confirmed that miscibility of blends was decreased. |
