| 초록 |
Imprint technology have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. Thermal imprinting method for thermo-set materials was developed for micro patterning on printed circuit board (PCB). In this study, vacuum hydrolic pressure type imprinting system is used for the delivery of uniform pressing force. As the mostly well known thermo-set polymer composite, epoxy resins reinforced with silica fillers were imprinted with polymer stamp. In order to understand imprinting mechanism of the epoxy resins, the rheological behaviors such as viscosity changes at elevated temperature and time of the epoxy resins were observed using rheometer (ARES, TA). All of the imprinted patterns were measured using SEM (S3000N, Hitachi) and confocal microscope (NT1100D, Veeco). Polymer stamp patterns with the feature size ranging from 10 µm to 60 µm were successfully transferred into epoxy thermo-set resin with high fidelity. |
