| 초록 |
Etching resist inkjet printing technology was studied to replace the conventional lithography process which has been widely used in PCB industry. For using this inkjet printing technology, line width, line shape, tolerance, and adhesion strength on Cu substrate are critical issues. Cu substrate must have a uniform roughness, large surface area, and controllable surface energy for uniform spreading of ER ink. Copper clad laminate were surface treated by soft micro-etching to increase the surface area, and also treated chemically with silane agent to adjust surface energy. Finally, printed patterns were etched and striped. As-printed and etched lines had the uniformity of 75±5㎛ and 75±15㎛, respectively. |
