| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
| 권호 | 28권 1호, p.233 |
| 발표분야 | 복합재료 |
| 제목 | Preparation and characterization of thermally conductive adhesives |
| 초록 | Recently, the removal of heat in microelctronic devices becomes increasingly important due to the smaller and denser packaging. One of the effective thermal dissipation methods is to use a thermally conductive adhesive containing ceramic fillers with high thermal conductivity, which provides thermal paths through the polymer matrix with poor thermal conductivity. In this study, we investigated thermal conductivities of the adhesives with various amounts of fillers having different sizes and shapes. Thermal conductivities were measured with TC Probe by using modified hot wire method. The peel and tack properties of the adhesives were also measured by using Text Analyzer. The results were compared with predictions. This work was supported by National Research Laboratory Program. |
| 저자 | 김종원;김진곤 |
| 소속 | 포항공과대 |
| 키워드 | thermal conductivity; adhesives |
