| 초록 |
Copper layer was plated on 100 um PET film as a substrate to enhance the electric properties for the material of electronic parts in a supercritical CO2 Plating System (SCPS). In SCPS, experiments were conducted in the range of 35~65℃ temperature, pH of 12.5, CuSO4•5H2O/NiSO4•6H2O=12.5 bath composition, SnCl2/PdCl2=16 activation composition, and the pressure of 7~17 Mpa, CO2/electrolyte (volume ratio) = 9 respectively. Characteristics of plated copper layer have a close relation with solubility in supercritical CO2 and solubility was dependent on pressure and temperature. Solubility in supercritical CO2 at about 16 Mpa was higher than at any other pressure and surface properties such as roughness, hardness, and conductivity on the copper layer at about 16 Mpa was the highest for all. The optimized temperature on the copper plating was showed at about 45℃. The effect of pH, bath composition, reaction time on the copper plating in SCPS was investigated as well. The electric properties of Cu/PET film electroless plating technology in SCPS were higher than those in conventional method. |
