| 초록 |
Electroplating is employed in industry to improve the appearance of surfaces, to give the good corrosion protection on the substrate, to improve the wear resistance by hard facing of the relatively soft substrate, and sometimes to provide the good electrical and thermal contact. However, acid and alkali aqueous solutions, a cyanide, chromium, heavy metal, corrosive materials, and toxic substances used in plating process raised the pollution of working environment because of waste water. Since the latter half of 1990's, many researches on the effective method to treat the waste water began centering around industries and research organizations. By this tendency, the clean technologies are required in plating process of domestic plating industries. For this reason, the current process and equipment are in need of changing into the environmentally friendly-technical installations. In this paper, we offer the new idea, the technology to reduce the plating solution by using sc CO2. This is the method that the Ni-plating solution/sc-CO2 emulsion is formed by using surfactant and then Ni in this emulsion is deposited to the surface of Cu substrate. For this study, the fluorocarbon-hydrocarbon(F-H) hybrid nonionic surfactants such as sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate (di-HCF4) which has both 'CO2 philic' chain and 'hydrophilic' chain was synthesized and was characterized by 1H NMR, 13C NMR, 19F NMR and DEPT NMR analysis. In addition, IFT of Ni-plating solution and CO2 was measured for investigating the effects of surfactant ethanol as a co-solvent. and After then, electroplating of Ni on the surface of Cu plate was carried in emulsion solution composed of CO2 and plating solution. The plating solution could be reduced to 1/4~1/7 times by this new electroplating technology. Quality value of plated ware can be evaluated by using the plating thickness, , and efficiency of plating. The quality values, such as corrosion resistance and uniformity of surface, of plated ware obtained by this new method was better than those by current method. When we consider various things synthetically, this research is expected to begreat helpful for reducing the waste water in plating process. Now, we are trying to improve the quality of plated ware and more detailed study is now in progress. |
