| 초록 |
The surface properties of polymers, such as, adhesion and permeation were largely influenced by the structures of the polymer surfaces. Polyimide (PI) was suitable for high temperature applications, such as, structural matrix resins, adhesive, coating and dielectric materials. However, the adhesion between polymer-metal interfaces had been a problem in the polyimide/Cu system. In this work, surface fluorination was thus executed to change functional groups on PI surface. PI had been fluorinated and oxyfluorinated for different times and fluorine-gas mixtures to investigate the effect of fluorination on adhesive strength. Contact angle method was used to determine the effect of fluorination on the surface tension of PI. And, the change of fluorinated and oxyfluorinated PI surface properties were characterized by means of X-ray photoelectron spectroscopy. Lap shear tests were also carried out to determine the adhesive properties of the surface fluorinated polyimide/Cu system.
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