| 학회 | 한국고분자학회 |
| 학술대회 | 2002년 봄 (04/12 ~ 04/13, 서울대학교) |
| 권호 | 27권 1호, p.138 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Mechanical and Thermal Properties of Poly(epoxy-imide)s for Electronic Materials |
| 초록 | The approaches for toughening modulus and glass transition temperature of the epoxy resins have been studied in industrial and academic areas. To enhance these properties, the hydroxy-containing fully aromatic polyimide film based on 2,2-bis(3,4’-dicarboxyfluoropropane) (6FDA) and 2,2-bis(3-amino-4-hydroxylphenyl)-hexafluoropropane (AHHFP) was prepared by thermal curing method and then reacted with biphenyl type epoxy resin (4,4’-diglycidyloxy-3,3’,5,5’-tetramethyl biphenyl). The mechanical and thermal properties of poly(epoxy-imide)s were investigated by DMTA, DSC and TFSA (Thin Film Stress Analyzer). In addition, the film orientation of polymer chain was studied by Prism-Coupler. For the all prepared poly(epoxy-imide) films, both mechanical and thermal stability were significantly dependent upon the composition of polyimide, which influenced on their morphological structure. Acknowledgement: This work was supported by Korea Research Foundation. |
| 저자 | 신준희, 이춘근, 이보영, 한학수 |
| 소속 | 연세대 |
| 키워드 | |
