| 학회 | 한국공업화학회 |
| 학술대회 | 2015년 가을 (11/04 ~ 11/06, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 | 19권 2호 |
| 발표분야 | 정밀화학_포스터 |
| 제목 | The effects of TEG-based levelers containing different counter anions on Cu electrodeposition |
| 초록 | The leveler, one of the organic additives on Cu electrodeposition, has been intensively explored because it performs the most important role in Cu gap-filling within microvia and Through Silicon Via (TSV). The role of the leveler is to decrease the topographical variation on Cu surface, which is possible from the convection dependent adsorption. However, the extraordinary behavior of leveler is not yet clarified in detail. Therefore, we designed triethylene glycol (TEG)-based leveler having two quaternary ammoniums at the ends of the molecule in order to provide deeper understanding of the leveler. The designed levelers containing different counter anion (Cl-, Br- or I-) were investigated for their electrochemical behaviors and their impacts on Cu gap-filling. |
| 저자 | 김영규, 김재정, 오정환, 이윤재, 김명준, 서영란 |
| 소속 | 서울대 |
| 키워드 | leveler; Cu electrodeposition |
