| 학회 | 한국공업화학회 |
| 학술대회 | 2015년 가을 (11/04 ~ 11/06, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 | 19권 2호 |
| 발표분야 | 정밀화학_포스터 |
| 제목 | Synthesis of a new TEG-based leveler and its electrochemical characteristics. |
| 초록 | Organic additives, especially a leveler, are essential to achieve defect-free Cu electrodeposition. The leveler assists bottom-up filling of Cu in trenches by selectively adsorbing on the opening of trenches resulting inhibition of Cu deposition. The adsorption site of the leveler has generally supposed to be ammonium functional group. Based on this assumption, we designed a new TEG-based leveler that has two ammonium groups at the both ends. The new leveler was efficiently synthesized over 4 steps from ethylene glycol. It has been confirmed that the leveler shows convection dependant adsorption behavior which is the essential characteristic for bottom-up filling. The leveler also applied to the Cu gap-filling of TSV-scaled trenches with a suppressor and an accelerator. |
| 저자 | 김영규, 김재정, 서영란, 김명준, 김회철, 이윤재 |
| 소속 | 서울대 |
| 키워드 | leveler; CU electrodeposition; TSV; organic additives |
