| 초록 |
Thermal conduction behaviors of SiC/Nylon6,6 and hBN/Nylon6,6 composites were investigated as the shape and content of fillers. Isotropic SiC fillers were homogeneously dispersed in Nylon6,6 matrix and identified by EDS mapping. Meanwhile, anisotropic hBN fillers were fully packed and oriented to one-direction in Nylon6,6 matrix. The thermal conductivity of SiC/Nylon6,6 composites with isotropic SiC fillers of 59 vol% increased from 0.25 to 3.83 W/mK, and the value of hBN/Nylon6,6 composites with anisotropic hBN fillers of 62 vol% increased from 0.25 to 2.16 W/mK. The experimental result of thermal conductivity was compared with the analytical model based on Maxwell-Eucken model, Lewis-Nielsen model and Cheng-Vachon model. As content of fillers increased, the thermal conductivity of SiC/Nylon6,6 composites was matched with Cheng-Vachon model. |
