| 학회 |
한국공업화학회 |
| 학술대회 |
2009년 봄 (04/15 ~ 04/17, 호텔인터불고(대구)) |
| 권호 |
13권 1호 |
| 발표분야 |
화학공정 |
| 제목 |
Surface treatment for device embedding PCBs |
| 초록 |
Embedding active/ passive devices into printed circuit boards (PCBs) offers scope of product design. These benefits include improvement in electric performance, reliability and potential cost reduction. Embedding process is structured several unit processes that are affected to the product yield of PCBs. Adhesion is a principal factor which has directly influence on reliability. This poster mentions an investigation of surface treatment method for adhesion. |
| 저자 |
신이나, 한미정, 김영주, 정태성
|
| 소속 |
(주) 삼성전기 |
| 키워드 |
adhesion; surface treatment; Embedding PCB
|
| E-Mail |
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