| 초록 |
Development of microelectromechanical systems (MEMS) is a rapidly growing technology with a broad range of commercial applications and diverse collection of evolving MEMS sensors and actuators. However, silicon and organic polymers, which are the most commonly employed materials for MEMS, cannot be utilized as the structural materials under harsh conditions. In the present paper, our main aim was to employ capillary force lithography (CFL) as a modified imprinting technique, as it is a secure and promising method to achieve large area patterns by using polydimethylsiloxane (PDMS) mold. In order to control the thickness of residual layers, which is considerably one of the main problems in the imprinting processes, we have also investigated certain parameters to control the thickness of residual layer by using imprinting techniques and Ar ion etching. |
