| 초록 |
Cure kinetics of epoxy resin systems with latent catalyst for crystalline epoxy molding compound (EMC) for semiconductor encapsulation were investigated. In this study, the self-extinguishable resin systems without flame retardant agents were introduced, and the cure properties of these self-extinguishable epoxy resin system with latent catalyst were examined in order to improve the physical properties and shelf life of EMC. A charge complex type catalyst and imidazole BASZ micro-encapsulated with polystyrene as latent catalyst were used. The cure kinetics of these systems were analyzed by differential scanning calorimetry using isothermal approach, and the kinetic parameters of all systems were reported in terms of generalized kinetic equation with the diffusion effects. |
