| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.358 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Morphological Properties of Polyimide Film Preparing by PAA/PAA-SiO₂Blend |
| 초록 | Polyimides(PI) are used for FPCB(flexible printed circuit board) due to high thermal resistance and mechanical property. In this study, pseudo poly(amic acid)(PAA) synthesized via sol-gel process for increase to adhesion with copper foil. Poly(amic acid)/pseudo PAA blend films were prepared by solvent casting method. These films having various compositions of APrTMOS. The CTE value was decreased according to increase APrTMOS contents. Their surface morphology and roughness were analyzed by SEM, AFM. It was found that the surface morphology was influenced by the composition of APrTMOS. Reference 1. M. A. Wahab, I. KIM, and C-S HA, J. Polym. Sci.: Polym. Chem., 42, 5189 (2004) |
| 저자 | 서관식, 설경일, 김용석, 이미혜, 이재흥, 원종찬 |
| 소속 | 한국화학(연) |
| 키워드 | PAA blend film; morphology; sol-gel |
