| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO)) |
| 권호 |
23권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Surface modification of hexagonal boron nitride for epoxy resin composites with thermal properties |
| 초록 |
The thermal dissipation is an important area of research in electronic equipment due to the miniaturization and functionalization of electronic equipment. Recently, researchers show on a lot of research on surface modification of fillers to improve interaction between fillers and polymers. The aim of this study is to determine thermal properties of three surface modification based on hexagonal boron nitride (hBN). Three types of modified hBN fillers were successfully modified with hydroxyl groups(-OH), amino groups(-NH2), and dendrimers, respectively. The modified hBN fillers were dispersed and mixed with bisphenol A diglycidyl ether (DGEBA) epoxy resin and 4-aminophenyl sulfone (DDS) hardener. And then pellets were prepared by hot-pressing to increase the thermal conductivity of the composites |
| 저자 |
박성원, 강주희, 권세진, 석웅철, 임종태, 송민성, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
hexagonal boron nitride; surface modification; epoxy resin; thermal conductivity
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| E-Mail |
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