화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2003년 봄 (04/11 ~ 04/12, 연세대학교)
권호 28권 1호, p.130
발표분야 고분자 구조 및 물성
제목 Crosslinking Behavior of Polyimide containing Pendent Acetylene Group in Various Crosslinking Density
초록 Glass transition temperature of the crosslinked polyimide is very high and thermogravimetric analysis also shows excellent thermal stability. In this study, we examined crosslinking behavior of polyimide containing acetylene moiety. Polyimides containing pendent acetylene group, 3,5-diamino-4-phenylethynyl-benzophenone (DAPEBP) and 3,5-diaminoethynylbenzene (DAEB) were prepared with pyromellitic dianhydride (PMDA) and the equimolar diamines which controlled the ratio of acetylene moiety and 4,4’-oxydianiline (ODA) in dimethylacetamide (DMAc). In DSC thermogram of polyimde the exothermal onset temperature appeared between 300 and 370℃, and the amount of exotherm were 1.1 ~ 10.5 cal/g according to the amount of acetylene moiety. At the same acetylene content, after higher heat treatment, the amount of exotherm was smaller. Its exotherm was slightly observed as heat treated at 400℃. In viscoelastic analysis, modulus drop was observed around 350℃ and disappeared at treated 400℃. Glass transition temperature (Tg) was increased as crosslinking density was increased. As higher crosslinking density, tensile modulus was more increased and elongation was more decreased. Tensile strength was remained constantly.
저자 김현석;마승락;홍영택;김석제;원종찬;최길영;원동영;박용인
소속 한국화학(연)
키워드 polyimide; film; crosslinking; acetylene; thermal stability
E-Mail