| 초록 |
In this study, nanoporous organosilicate low-k thin films were prepared using porogens grafted and bridged to silsesquioxane precusor, where adamantanephenyl group was used as a porogen and precusors containing porogens were polymerized with methyltrimethoxysilane (MTMS) with given comonomer contents. For all films tested, dielectric constants and refractive indices reduce with curing temperature due to the formation of nanoporous structure by the decomposition of porogen. On the other hand, elastic modulus in bridged copolymers is further not decreased with the decomposition of porogen, which is believed to be due to the enhancement of crosslinking density by high silanolizable groups in bridged comonomer and tetra-coordinated Si-O structures by the cleavage of silicon-carbon bonds in covalently bonded porogens. This strategy can be further applied for preparing nanoporous films with balanced robust mechanical properties and low dielectric properties. |
