| 초록 |
Imprint process is used for making fine line patterns of PCB (printed ciruit board). Since imprint technique can make via holes as well as fine line patterns simultaneously, it can reduce number of processes such as laser drilling and photo-litho processes. However, it has a residue issue, which is a critical problem for via hole connection between layers of PCB. In case of imprinting large panel, it becomes more serious. Using conventional vacuum press, the thickness of residue after imprint varies 1 to 20um. In this study, residue thickness is controlled under 1 um using isostatic pressure. Other advantages of using isostatic pressure in large area imprint process would be discussed based on actual imprinted data. |
